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DS-33 Acid Copper Plating Additives Low Internal Stress High Ductility

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DS-33 Acid Copper Plating Additives Low Internal Stress High Ductility

Delivery Time : 5-8 work day

Model Number : DS-33

Type : Acid Copper Additive

Cathode Current Density : 1-6 A/dm²

Product Code : DS-33

Payment Terms : T/T

Anode Material : Phosphor Copper

Place of Origin : China

MOQ : 25-30kg

Packaging Details : 25kg/drum

Operating Temperature : 20-45 ℃

Features : Low Internal Stress, Outstanding Ductility

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DS-33 Acid Copper Plating Additive
Performance & Features
  1. Excellent leveling performance across a wide range from high-current to low-current density areas.
  2. Low internal stress and outstanding ductility of deposits.
  3. Superior brightness and covering power especially in low-current regions.
  4. Excellent heat resistance.
  5. Produces bright, clear and attractive coating appearance.
  6. Main bath components can be analyzed accurately for precise bath maintenance.
Operating Parameters
Item Working Range
Cathode Current Density 1–6 A/dm²
Anode Current Density 1–3 A/dm² (Optimal: 3–9 A/dm²)
Bath Temperature 20–45 ℃
Agitation Vigorous air agitation
Filtration Continuous filtration without activated carbon
Anode Material Phosphor copper anode


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Copper Plating Additives Low Internal Stress

      

Copper Plating Additives High Ductility

      
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